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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14157455
Filing Dt:
01/16/2014
Publication #:
Pub Dt:
05/15/2014
Inventors:
Thomas Joachim Werner MOERSHEIM, Fernando Villon Capinig, Dandy Navarro Jaducana et al
Title:
Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) For Lighting Solutions And Method Of Manufacturing Thereof
Assignment: 1
Reel/Frame:
032228/0522Recorded: 01/21/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/04/2011
Exec Dt:
10/04/2011
Exec Dt:
10/04/2011
Exec Dt:
10/04/2011
Assignee:
LOT C3-6 CARMELRAY INDUSTRIAL PARK, II
BARANGAY PUNTA, CALAMBA LAGUNA, PHILIPPINES 4027
Correspondent:
PYPRUS PTE LTD
7500A BEACH ROAD, #07-301 THE PLAZA
SINGAPORE 199591

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