Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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14079075
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Filing Dt:
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11/13/2013
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Publication #:
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Pub Dt:
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05/22/2014
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Inventor:
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In Gyun Jeon
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Title:
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METHOD FOR ELECTRICALLY CONNECTING WAFERS USING BUTTING CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE FABRICATED THROUGH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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20F BUNDANG SQUARE, 263 SEOHYEON-DONG, BUNDANG-GU |
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 463-050 |
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KILE PARK REED & HOUTTEMAN PLLC |
1200 NEW HAMPSHIRE AVE. NW |
SUITE 570 |
WASHINGTON, DC 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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IP&T GROUP LLP |
8230 LEESBURG PIKE SUITE 650 |
VIENNA, VA 22182 |
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