Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/04/2014
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Application #:
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13678847
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Filing Dt:
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11/16/2012
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Publication #:
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Pub Dt:
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05/22/2014
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Inventors:
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Lei Shi, Yan Xun Xue, Yuping Gong
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Title:
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Flip-chip Semiconductor Chip Packing Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ZEPHYR HOUSE, 122 MARRY STREET, P.O. BOX 709, |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1107 |
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| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
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