Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/06/2015
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Application #:
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14174754
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Filing Dt:
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02/06/2014
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Publication #:
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Pub Dt:
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06/05/2014
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Inventors:
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Pan Soo Kim, Duk Haeng Lee, Woon Suk Jung
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Title:
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COPPER PLATING SOLUTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 15 BLOCK 1LOT, BANWOL INDUSTRIAL COMPLEX |
| MONKNAE-RO 119-91, DANWON-GU, GYEONGGI-DO |
| ANSAN-SI, KOREA, REPUBLIC OF 425-100 |
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| BING AI |
| PERKINS COIE LLP |
| PO BOX 1247 |
| SEATTLE, WA 98111-1247 |
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