Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2018
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Application #:
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13710933
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Filing Dt:
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12/11/2012
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Publication #:
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Pub Dt:
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06/12/2014
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Inventor:
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Ying-Zhong Chen
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Title:
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SEMICONDUCTOR LEAD FRAME PACKAGE AND LED PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| MCKAY AND HODGSON, LLP |
| 1900 GARDEN ROAD, SUITE 220 |
| MONTEREY, CA 93940 |
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