Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/23/2016
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Application #:
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13718130
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Filing Dt:
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12/18/2012
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Publication #:
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Pub Dt:
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06/19/2014
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Inventors:
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Karthik Thambidurai, Viren Khandekar, Tiao Zhou
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Title:
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LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WAFER-LEVEL PACKAGING (WLP) PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 160 RIO ROBLES |
| SAN JOSE, CALIFORNIA 95134 |
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| ADVENT IP/MAXIM |
| 2425 SOUTH 144TH STREET, SUITE 202 |
| OMAHA, NE 68144 |
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