Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2017
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Application #:
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14138196
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Filing Dt:
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12/23/2013
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Publication #:
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Pub Dt:
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07/03/2014
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Inventors:
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Konosuke Hayashi, Emi Matsui
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Title:
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BONDING APPARATUS AND BONDING PROCESS METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, KASAMA 2-CHOME, SAKAE-KU |
| YOKOHAMA-SHI, KANAGAWA-KEN, JAPAN |
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| PEARNE & GORDON |
| 1801 EAST NINTH STREET |
| SUITE 1200 |
| CLEVELAND, OH 44114 |
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