Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2016
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Application #:
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13797112
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Filing Dt:
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03/12/2013
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Publication #:
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Pub Dt:
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07/24/2014
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Inventors:
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Andrew Nguyen, Mei Sun, Vaibhaw Vishal, Kristopher K. Hearn
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Title:
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METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE TECHNOLOGY DRIVE |
MILPITAS, CALIFORNIA 95035 |
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JOSHUA D. ISENBERG |
809 CORPORATE WAY |
FREMONT, CA 94539 |
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