Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/01/2015
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Application #:
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13883730
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Filing Dt:
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08/02/2013
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Publication #:
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Pub Dt:
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07/24/2014
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Inventors:
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Berthold Hahn, Karl Engl, Tetsuya Taki, Johannes Baur, Volker Härle, Joachim Hertkorn
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Title:
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Composite Substrate, Semiconductor Chip Having a Composite Substrate and Method for Producing Composite Substrates and Semiconductor Chips
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEIBNIZSTRASSE 4 |
| REGENSBURG, GERMANY 93055 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON RD. |
| SUITE 1000 |
| DALLAS, TX 75252 |
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