Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13751207
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Filing Dt:
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01/28/2013
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Publication #:
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Pub Dt:
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07/31/2014
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Inventors:
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Ralf Otremba, Klaus Schiess, Wolfgang Scholz, Teck Sim Lee, Fabio Brucchi, Davide Chiola et al
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Title:
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CHIP ARRANGEMENT AND CHIP PACKAGE HAVING A FIRST LEADFRAME PORTION AND A SECOND LEADFRAME PORTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA 9500 |
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| VIERING, JENTSCHURA & PARTNER - INF |
| 3770 HIGHLAND AVE. |
| SUITE 203 |
| MANHATTAN BEACH, CA 90266 |
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