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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/21/2019
Application #:
14342267
Filing Dt:
02/28/2014
Publication #:
Pub Dt:
08/07/2014
Inventor:
Soon Yong Park
Title:
POLYMER RESIN COMPOSITION, POLYIMIDE RESIN FILM, PREPARATION METHOD OF POLYIMIDE RESIN FILM, FLEXIBLE METAL LAMINATE, AND CIRCUIT BOARD
Assignment: 1
Reel/Frame:
032327/0706Recorded: 02/28/2014Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/18/2014
Assignee:
128 YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 150-721
Correspondent:
ROTHWELL, FIGG, ERNST & MANBECK, P.C.
607 14TH STREET, N.W.
SUITE 800
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
043729/0137Recorded: 09/28/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/12/2017
Assignee:
NO.5 WESTERN INDUSTRY ROAD, SONGSHAN LAKE NATIONAL HIGH-TECH INDUSTRIAL DEVELOPMENT ZONE
DONGGUAN CITY, GUANGDONG, CHINA 523808
Correspondent:
ROTHWELL, FIGG, ERNST & MANBECK, P.C.
607 14TH STREET, N.W.
SUITE 800
WASHINGTON, DC 20005

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