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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/10/2017
Application #:
14348356
Filing Dt:
03/28/2014
Publication #:
Pub Dt:
08/21/2014
Inventors:
Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
Title:
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AND A POWER SEMICONDUCTOR WHICH IS USED TO BOND TO THICK WIRES OR STRIPS
Assignment: 1
Reel/Frame:
032942/0583Recorded: 05/21/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/19/2014
Exec Dt:
03/19/2014
Exec Dt:
03/17/2014
Exec Dt:
03/21/2014
Assignee:
HUSUMER STRASSE 251
FLENSBURG, GERMANY DE 24941
Correspondent:
MARINA F. CUNNINGHAM MCCORMICK PAULDING
185 ASYLUM ST. CITY PLACE 11, 18TH FL.
6495-0622WOUS
HARTFORD, CT 06103-3410

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