Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/19/2015
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Application #:
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13787219
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Filing Dt:
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03/06/2013
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Publication #:
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Pub Dt:
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09/04/2014
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Inventors:
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Young Kyu Song, Yunseo Park, Xiaonan Zhang, Ryan David Lane, Babak Nejati et al
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Title:
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HIGH QUALITY FACTOR INDUCTOR IMPLEMENTED IN WAFER LEVEL PACKAGING (WLP)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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