Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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13968797
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Filing Dt:
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08/16/2013
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Publication #:
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Pub Dt:
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09/11/2014
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Inventors:
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Chang-Hwang HUA, Chih-Hsien LIN
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Title:
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STRUCTURE OF A SEMICONDUCTOR CHIP WITH SUBSTRATE VIA HOLES AND METAL BUMPS AND A FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 69, TECHNOLOGY 7TH RD. |
HWAYA TECHNOLOGY PARK, KUEI SHAN HSIANG |
TAO YUAN SHIEN, TAIWAN |
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JOE MCKINNEY MUNCY |
4000 LEGATO ROAD |
SUITE 310 |
FAIRFAX, VA 22033 |
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