Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/24/2015
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Application #:
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13843304
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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09/18/2014
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Inventor:
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Yung-Hui Wang
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Title:
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SEMICONDUCTOR WAFER, SEMICONDUCTOR PROCESS AND SEMICONDUCTOR PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN 811 |
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GEORGE D. MORGAN |
4635 S. LAKESHORE DR., SUITE 131 |
TEMPE, AZ 85282 |
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