Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/24/2015
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Application #:
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13801071
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Filing Dt:
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03/13/2013
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Publication #:
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Pub Dt:
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09/18/2014
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Inventors:
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Alper Buyuktosunoglu, Philip G. Emma, Allan M. Hartstein, Michael B. Healy et al
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Title:
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THREE-DIMENSIONAL COMPUTER PROCESSOR SYSTEMS HAVING MULTIPLE LOCAL POWER AND COOLING LAYERS AND A GLOBAL INTERCONNECTION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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FRANK V. DEROSA |
90 FOREST AVENUE |
RYAN, MASON & LEWIS, LLP |
LOCUST VALLEY, NY 11560 |
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