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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/06/2016
Application #:
13847681
Filing Dt:
03/20/2013
Publication #:
Pub Dt:
09/25/2014
Inventors:
Ralf Otremba, Josef Hoeglauer, Xaver Schloegel, Chooi Mei Chong
Title:
Multi-Chip Semiconductor Power Device
Assignment: 1
Reel/Frame:
031466/0558Recorded: 10/24/2013Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/10/2013
Exec Dt:
09/17/2013
Exec Dt:
09/10/2013
Exec Dt:
08/28/2013
Assignee:
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
8000 REGENCY PARKWAY
SUITE 415
CARY, NC 27518

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