Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13818034
|
Filing Dt:
|
02/20/2013
|
Publication #:
|
|
Pub Dt:
|
09/25/2014
| | | | |
Inventors:
|
Jae Hong Lee, II Ho Kim, Sung Jae Hong, Jeong Tak Moon
|
Title:
|
TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
316-2 GEUMEO-RI, POGOK-EUP, CHEOIN-GU |
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 449-812 |
|
|
|
VOLPE AND KOENIG, P.C. |
30 SOUTH 17TH STREET |
PHILADELPHIA, PA 19103 |
|
|
Search Results as of:
09/23/2024 06:52 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|