Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2019
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Application #:
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14235358
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Filing Dt:
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05/24/2014
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Publication #:
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Pub Dt:
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10/23/2014
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Inventors:
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Jean Brun, Delphine Christophe, Lionel Tenchine
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Title:
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Method for Assembling a Microelectronic Chip Device in a Fabric, Chip Device, and Fabric Incorporating a Crimped Chip Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 25 RUE LEBLANC, BATIMENT "LE PONANT D" |
| PARIS, FRANCE F-75015 |
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| 2 RUE PIERRE ET MARIE CURIE, |
| BELLIGNAT, FRANCE F-01100 |
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| FROMMER LAWRENCE & HAUG |
| 745 FIFTH AVENUE- 10TH FL. |
| NEW YORK, NY 10151 |
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