Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14249337
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Filing Dt:
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04/09/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Inventors:
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Masayuki Ishii, Saki Suzuki, Kozo Kitamura, Kazuhiko Tsuchiya, Minoru Saito, Osamu Terada et al
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Title:
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Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance, Heat Sink Using The Same, Electronic Device Using The Heat Sink, And Method For Producing Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-17-10, SHIMOMARUKO, OHTA-KU |
| TOKYO, JAPAN 146-0092 |
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| ROBERTS & ROBERTS, LLP, ATTORNEYS AT LAW |
| P.O. BOX 484 |
| PRINCETON, NJ 08542-0484 |
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