Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13897701
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Filing Dt:
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05/20/2013
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Publication #:
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Pub Dt:
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11/20/2014
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Inventors:
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Jianmin Wang, Serapion C. Daof, Senghong Chua, Meng Lee
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Title:
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DUAL-SIDE WAFER BAR GRINDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TERMINAL DRIVE |
| PLAINVIEW, NEW YORK 11803 |
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| HOLZERIPLAW, PC |
| 216 16TH STREET |
| SUITE 1350 |
| DENVER, CO 80202 |
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