Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/23/2015
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Application #:
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14350404
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Filing Dt:
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04/08/2014
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Publication #:
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Pub Dt:
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11/27/2014
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Inventors:
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Armand Pruijmboom, Raimond Louis Dumoulin, Michael Miller
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Title:
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METHOD OF ASSEMBLING VCSEL CHIPS ON A SUB-MOUNT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 5 |
| EINDHOVEN, NETHERLANDS 5656AE |
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| MICHAEL E. MARION |
| P.O. BOX 3001 |
| INTELLECTUAL PROPERTY & STANDARDS |
| BRIARCLIFF MNR., NY 10510-8001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LISE-MEITNER-STRASSE 13 |
| ULM, GERMANY 89081 |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 NORTH STETSON AVENUE |
| CHICAGO, IL 606016731 |
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