Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14270131
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Filing Dt:
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05/05/2014
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Publication #:
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Pub Dt:
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12/04/2014
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Inventors:
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Hyun Chul Jung, Joon Seok Kang, Jang Bae Son, Sang Hyun Shin, Kwang Jik Lee et al
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Title:
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INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY AND ELECTRICAL PROPERTIES, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| LADAS & PARRY |
| 5670 WILSHIRE BOULEVARD, SUITE 2100 |
| LOS ANGELES, CA 90036-5679 |
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