Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14296126
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Filing Dt:
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06/04/2014
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Publication #:
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Pub Dt:
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12/11/2014
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Inventor:
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Myung Sam KANG
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Title:
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SEMICONDUCTOR PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| LADAS & PARRY LLP |
| 5670 WILSHIRE BLVD. |
| SUITE 2100 |
| LOS ANGELES, CA 90036-5679 |
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