Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2016
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Application #:
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14315163
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Filing Dt:
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06/25/2014
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Publication #:
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Pub Dt:
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01/01/2015
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Inventors:
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Tsang-Yu LIU, Ying-Nan WEN, Yi-Ming CHANG, Yen-Shih HO
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Title:
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CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD. |
ZHONGLI CITY, TAOYUAN COUNTY, TAIWAN 320 |
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WEN LIU |
350 S. FIGUEROA STREET, SUITE 975 |
LOS ANGELES, CA 90071 |
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09/28/2024 08:37 AM
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