Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/08/2016
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Application #:
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14292896
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Filing Dt:
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05/31/2014
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Publication #:
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Pub Dt:
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01/08/2015
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Inventors:
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MING-KUN WENG, MENG-SUNG CHOU
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Title:
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FLIP-CHIP LIGHT EMITTING DIODE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 25, GUANGPU W. RD. GUANGZHOU SCIENCE CITY, GUANGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
GUANGZHOU, CHINA |
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22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST. |
TAIPEI CITY, TAIWAN |
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
3057 NUTLEY STREET |
SUITE 818 |
FAIRFAX, VA 22031 |
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