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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/26/2015
Application #:
14329856
Filing Dt:
07/11/2014
Publication #:
Pub Dt:
01/08/2015
Inventor:
Martin Standing
Title:
Power Semiconductor Package with Multiple Dies
Assignment: 1
Reel/Frame:
033300/0408Recorded: 07/11/2014Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/28/2008
Assignee:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MICHAEL FARJAMI
26522 LA ALAMEDA AVE., SUITE 360
MISSION VIEJO, CA 92691
Assignment: 2
Reel/Frame:
038395/0815Recorded: 04/27/2016Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/29/2015
Assignee:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MICHAEL FARJAMI
26522 LA ALAMEDA AVE. SUITE 360
MISSION VIEJO, CA 92691

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