Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/11/2017
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Application #:
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14332269
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Filing Dt:
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07/15/2014
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Publication #:
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Pub Dt:
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01/15/2015
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Inventors:
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Wei-Cheng KU, Jun-Liang LAI, Chun-Chung HUANG, Jing-Zhi HUNG, Yung Nan WU, Chih-Hao HO
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Title:
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MULTILAYER CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-3F., NO.155, ZHONGHE ST. |
| ZHUBEI, TAIWAN 302 |
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| APEX JURIS, PLLC |
| 12733 LAKE CITY WAY NORTHEAST, SUITE 101 |
| SEATTLE, WA 98125 |
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