Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/12/2016
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Application #:
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14289814
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Filing Dt:
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05/29/2014
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Publication #:
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Pub Dt:
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01/15/2015
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Inventors:
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Heungkyu Kwon, Sangho An
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Title:
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SEMICONDUCTOR PACKAGES INCLUDING A METAL LAYER BETWEEN FIRST AND SECOND SEMICONDUCTOR CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 443-742 |
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| MYERS BIGEL SIBLEY & SAJOVEC |
| 4140 PARKLAKE AVENUE |
| SUITE 600 |
| RALEIGH, NC 27612 |
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