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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14022579
Filing Dt:
09/10/2013
Publication #:
Pub Dt:
01/15/2015
Inventors:
Sidney Shen Kuang Chou, Jackie Ka Yip Wong, Shu Deng, Xin Zhong, Lu Xiao
Title:
HEAD STACK ASSEMBLY, HARD DISK DRIVE, AND METHOD OF CONNECTING A HEAD GIMBAL ASSEMBLY TO A FLEXIBLE PRINTED CIRCUIT ASSEMBLY IN A HEAD STACK ASSEMBLY
Assignment: 1
Reel/Frame:
031585/0525Recorded: 11/12/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/17/2013
Exec Dt:
10/16/2013
Exec Dt:
10/16/2013
Exec Dt:
10/16/2013
Exec Dt:
10/16/2013
Assignee:
SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T.
HONG KONG, CHINA
Correspondent:
NIXON & VANDERHYE, PC
901 NORTH GLEBE ROAD, 11TH FLOOR
ARLINGTON, VA 22203

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