Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14516600
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Filing Dt:
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10/17/2014
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Publication #:
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Pub Dt:
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02/05/2015
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Inventors:
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Chandrashekar Raman, Wayne A. Earley
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Title:
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THERMALLY CONDUCTIVE POLYMER COMPOSITIONS TO REDUCE MOLDING CYCLE TIME
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 383 MADISON AVENUE |
| NEW YORK, NEW YORK 10179 |
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| SCOTT A. MCKINNEY |
| 1285 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10019-6064 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 260 HUDSON RIVER ROAD |
| WATERFORD, NEW YORK 12188 |
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| GREENBERG TRAURIG, LLP |
| 200 PARK AVE. |
| NEW YORK, NY 10166 |
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