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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/16/2017
Application #:
14532224
Filing Dt:
11/04/2014
Publication #:
Pub Dt:
02/26/2015
Inventors:
MICHAEL RAYMOND WEATHERSPOON, LOUIS JOSEPH RENDEK JR., LAWRENCE WAYNE SHACKLETTE et al
Title:
METHOD TO MAKE A MULTILAYER CIRCUIT BOARD WITH INTERMETALLIC COMPOUND AND RELATED CIRCUIT BOARDS
Assignment: 1
Reel/Frame:
034097/0396Recorded: 11/04/2014Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/19/2011
Exec Dt:
10/19/2011
Exec Dt:
10/19/2011
Exec Dt:
10/19/2011
Assignee:
1025 WEST NASA BLVD.
MELBOURNE, FLORIDA 32919
Correspondent:
CHRISTOPHER F. REGAN
255 S. ORANGE AVENUE
SUITE 1401
ORLANDO, FL 32801

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