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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14010409
Filing Dt:
08/26/2013
Publication #:
Pub Dt:
02/26/2015
Inventors:
Lei Wang, Hyo Chang Yun
Title:
Adhesive Manufacturing Process, an Adhesive, and an Article
Assignment: 1
Reel/Frame:
031085/0561Recorded: 08/26/2013Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/26/2013
Exec Dt:
08/26/2013
Assignee:
1050 WESTLAKES DRIVE
BERWYN, PENNSYLVANIA 19312
Correspondent:
MARGUERITE E. GERSTNER
309 CONSTITUTION DRIVE
M/S R34/2A
MENLO PARK, CA 94025-1164

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