Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14472365
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Filing Dt:
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08/28/2014
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Publication #:
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Pub Dt:
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03/05/2015
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Inventors:
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Jung Hyun PARK, Sung Won JEONG, Gi Ho HAN, Ki Hwan KIM, Yong Yoon CHO, Da Hee KIM
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Title:
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INTERPOSER AND SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING INTERPOSER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 150, MAEYEONG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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