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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10262951
Issue Dt:
04/16/2019
Application #:
14279601
Filing Dt:
05/16/2014
Publication #:
20150069588
Pub Dt:
03/12/2015
Inventors:
Godfrey Sauti, Jin Ho Kang, Cheol Park, Sheila A. Thibeault, Robert G. Bryant et al
Title:
RADIATION HARDENED MICROELECTRONIC CHIP PACKAGING TECHNOLOGY
Assignment: 1
Reel/Frame:
033080/0984Recorded: 06/03/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KANG, JIN HO
Exec Dt:
05/08/2014
PARK, CHEOL
Exec Dt:
05/08/2014
SAUTI, GODFREY
Exec Dt:
04/16/2014
GIBBONS, LUKE
Exec Dt:
04/30/2014
Assignee:
NATIONAL INSTITUTE OF AEROSPACE ASSOCIATES
100 EXPLORATION WAY
HAMPTON, VIRGINIA 23666-6157
Correspondent:
ROBERT E. SMARTSCHAN
150 WEST MAIN STREET
P.O. BOX 3037
NORFOLK, VA 23514-3037
Assignment: 2
Reel/Frame:
033709/0696Recorded: 09/10/2014Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
THIBEAULT, SHEILA A.
Exec Dt:
05/12/2014
LOWTHER, SHARON E.
Exec Dt:
05/12/2014
BRYANT, ROBERT G.
Exec Dt:
05/12/2014
Assignee:
UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
300 E. STREET SW
WASHINGTON, DISTRICT OF COLUMBIA 20546
Correspondent:
NASA LANGLEY RESEARCH CENTER
OFFICE OF CHIEF COUNSEL
MAIL STOP 30
HAMPTON, VA 23681-2199

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