Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/2017
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Application #:
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14031714
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Filing Dt:
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09/19/2013
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Publication #:
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Pub Dt:
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03/19/2015
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Inventors:
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Leilei Zhang, Abraham Yee, Ron Boja, Zuhair Bokharey
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Title:
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STIFFENING ELECTRONIC PACKAGES BY DISPOSING A STIFFENER RING BETWEEN SUBSTRATE CENTER AREA AND CONDUCTIVE PAD
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2701 SAN TOMAS EXPRESSWAY |
SANTA CLARA, CALIFORNIA 95050 |
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NVIDIA C/O MURABITO, HAO & BARNES LLP |
TWO NORTH MARKET STREET |
THIRD FLOOR |
SAN JOSE, CA 95113 |
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