Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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14559656
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Filing Dt:
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12/03/2014
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Publication #:
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Pub Dt:
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03/26/2015
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Inventor:
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Katsuyuki Sakuma
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Title:
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FORMATION OF THROUGH-SILICON VIA (TSV) IN SILICON SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| INTERNATIONAL BUSINESS MACHINES CORPORATION |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION IP LAW DEPARTMENT |
| 294 ROUTE 100 |
| P.O. BOX 100 |
| SOMERS, NY 10589 |
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