Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14570854
|
Filing Dt:
|
12/15/2014
|
|
Publication #:
|
|
Pub Dt:
|
04/09/2015
| | | | |
|
Inventors:
|
Hsiang-Hung CHANG, Wen-Chih CHEN, Chia-Wei JUI, Zhi-Cheng HSIAO, Cheng-Ta KO et al
|
|
Title:
|
CONDUCTIVE VIA STRUCTURE, PACKAGE STRUCTURE, AND PACKAGE OF PHOTOSENSITIVE DEVICE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 195, SEC. 4, ZHONGXING RD., |
| ZHUDONG TOWNSHIP, HSINCHU COUNTY, TAIWAN 310 |
|
|
|
|
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
|
|
Search Results as of:
05/12/2024 07:53 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
