Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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14511002
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Filing Dt:
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10/09/2014
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Publication #:
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Pub Dt:
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04/16/2015
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Inventors:
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Luca Maggi, Sebastiano Conti
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Title:
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MICROELECTROMECHANICAL DEVICE WITH PROTECTION FOR BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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VIA C. OLIVETTI, 2 |
AGRATE BRIANZA, ITALY 20864 |
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KAREN M. HENCKEL |
701 FIFTH AVENUE, SUITE 5400 |
SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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CHEMIN DU CHAMP-DES-FILLES 39 |
1228 PLAN-LES-OUATES |
GENEVA, SWITZERLAND |
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STMICROELECTRONICS, INC. |
750 CANYON DRIVE, SUITE 300 |
COPPELL, TX 75019 |
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