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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/26/2019
Application #:
14511002
Filing Dt:
10/09/2014
Publication #:
Pub Dt:
04/16/2015
Inventors:
Luca Maggi, Sebastiano Conti
Title:
MICROELECTROMECHANICAL DEVICE WITH PROTECTION FOR BONDING
Assignment: 1
Reel/Frame:
033927/0897Recorded: 10/10/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/06/2014
Exec Dt:
10/08/2014
Assignee:
VIA C. OLIVETTI, 2
AGRATE BRIANZA, ITALY 20864
Correspondent:
KAREN M. HENCKEL
701 FIFTH AVENUE, SUITE 5400
SEATTLE, WA 98104
Assignment: 2
Reel/Frame:
060301/0355Recorded: 06/07/2022Pages: 46
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/30/2022
Assignee:
CHEMIN DU CHAMP-DES-FILLES 39
1228 PLAN-LES-OUATES
GENEVA, SWITZERLAND
Correspondent:
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300
COPPELL, TX 75019

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