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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/15/2015
Application #:
14051209
Filing Dt:
10/10/2013
Publication #:
Pub Dt:
04/16/2015
Inventor:
Jordan L. Sedivy
Title:
EXTRUSION DIE WITH DECKLE SYSTEM AND METHODS OF USING SAME
Assignment: 1
Reel/Frame:
031386/0109Recorded: 10/11/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/10/2013
Assignee:
911 KURTH ROAD
CHIPPEWA FALLS, WISCONSIN 54729-1443
Correspondent:
PAUL J. LAVANWAY, JR.
200 SOUTH SIXTH STREET
SUITE 4000
MINNEAPOLIS, MN 55402-1425
Assignment: 2
Reel/Frame:
033652/0616Recorded: 09/02/2014Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/20/2014
Assignee:
28601 CLEMENS ROAD
WESTLAKE, OHIO 44145
Correspondent:
FREDRIKSON & BYRON, P.A.
200 SOUTH SIXTH ST., SUITE 4000
MINNEAPOLIS, MN 55402-1425

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