Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/04/2016
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Application #:
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14103529
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Filing Dt:
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12/11/2013
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Publication #:
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Pub Dt:
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04/16/2015
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Inventors:
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Wei-Sheng Lei, Brad Eaton, Ajay Kumar
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Title:
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METHOD AND APPARATUS FOR DICING WAFERS HAVING THICK PASSIVATION POLYMER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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