Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/07/2017
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Application #:
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14524894
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Filing Dt:
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10/27/2014
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Publication #:
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Pub Dt:
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04/30/2015
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Inventor:
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Michael James Glickman
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Title:
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NANO-COPPER SOLDER FOR FILLING THERMAL VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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305 INTERLOCKEN PARKWAY |
BROOMFIELD, COLORADO 80021 |
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THOMAS B. HAVERSTOCK |
162 N WOLFE ROAD |
SUNNYVALE, CA 94086 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6201 AMERICA CENTER DRIVE |
SAN JOSE, CALIFORNIA 95002 |
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THOMAS B. HAVERSTOCK |
162 NORTH WOLFE ROAD |
SUNNYVALE, CA 94086 |
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09/26/2024 08:41 AM
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