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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/27/2016
Application #:
14323664
Filing Dt:
07/03/2014
Publication #:
Pub Dt:
05/07/2015
Inventors:
Mark H. SOMERVELL, Benjamen M. RATHSACK, Ian J. BROWN, Steven SCHEER, Joshua S. HOOGE
Title:
LINE PATTERN COLLAPSE MITIGATION THROUGH GAP-FILL MATERIAL APPLICATION
Assignment: 1
Reel/Frame:
033320/0482Recorded: 07/16/2014Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/07/2014
Exec Dt:
07/07/2014
Exec Dt:
07/03/2014
Exec Dt:
07/04/2014
Exec Dt:
07/07/2014
Assignee:
3-1 AKASAKA 5-CHOME
AKASAKA BIZ TOWER
MINATO-KU, TOKYO, JAPAN 107-6325
Correspondent:
TOKYO ELECTRON U.S. HOLDINGS, INC.
2400 GROVE BLVD.
AUSTIN, TX 78741

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