Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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14605486
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Filing Dt:
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01/26/2015
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Publication #:
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Pub Dt:
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05/14/2015
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Inventors:
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Quanbo Zou, Uppili Sridhar, Amit S. Kelkar, Xuejun Ying
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Title:
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BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 160 RIO ROBLES DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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