Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14568189
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Filing Dt:
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12/12/2014
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Publication #:
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Pub Dt:
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05/21/2015
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Inventors:
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Takenori OSADA, Tomoyuki TAKADA, Masahiko HATA, Tetsuji YASUDA, Tatsuro MAEDA et al
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Title:
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SEMICONDUCTOR WAFER, METHOD OF PRODUCING A SEMICONDUCTOR WAFER AND METHOD OF PRODUCING A COMPOSITE WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 27-1, SHINKAWA 2-CHOME |
| CHUO-KU, TOKYO, JAPAN 104-8260 |
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| 3-1, KASUMIGASEKI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8921 |
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| JOHN CALLAHAN, SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVE., NW, #800 |
| WASHINGTON, DC 20037 |
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