Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/01/2016
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Application #:
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14227985
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Filing Dt:
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03/27/2014
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Publication #:
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Pub Dt:
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06/04/2015
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Inventors:
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YI-LUN CHENG, CHIH-KAI YANG
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Title:
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HEAT DISSIPATION MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 789 PUXING ROAD, MIN HANG DISTRICT |
| SHANGHAI, CHINA 201114 |
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| NO. 66, HOU-KANG STREET |
| SHIH-LIN DISTRICT |
| TAIPEI CITY, TAIWAN |
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| HUFFMAN LAW GROUP, P.C. |
| 7702 BARNES RD., STE. 140-46 |
| COLORADO SPRINGS, CO 80922 |
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