Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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14453858
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Filing Dt:
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08/07/2014
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Publication #:
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Pub Dt:
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07/09/2015
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Inventors:
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Yu-Min Liang, Jiun Yi Wu
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Title:
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Protrusion Bump Pads for Bond-on-Trace Processing
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL LLP |
| 17950 PRESTON RD., SUTE 1000 |
| DALLAS, TX 75252 |
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