Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14613086
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Filing Dt:
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02/03/2015
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Publication #:
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Pub Dt:
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08/06/2015
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Inventors:
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Toshio Hasegawa, Manabu Oie, Steven Consiglio, Kaoru Maekawa, Kai-Hung Yu et al
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Title:
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INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu FILLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AKASAKA BIZ TOWER |
3-1 AKASAKA 5-CHOME |
MINATO-KU, TOKYO, JAPAN 107-6325 |
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TOKYO ELECTRON U.S. HOLDINGS, INC. |
2400 GROVE BLVD. |
AUSTIN, TX 78741 |
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05/16/2024 01:21 PM
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