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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/16/2017
Application #:
14612817
Filing Dt:
02/03/2015
Publication #:
Pub Dt:
08/06/2015
Inventors:
Shunpei YAMAZAKI, Kenichi OKAZAKI, Masataka NAKADA, Masahiro KATAYAMA
Title:
Semiconductor Device, Manufacturing Method Thereof, Module, and Electronic Device
Assignment: 1
Reel/Frame:
034877/0401Recorded: 02/03/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/15/2015
Exec Dt:
01/19/2015
Exec Dt:
01/19/2015
Exec Dt:
01/19/2015
Assignee:
398 HASE
ATSUGI-SHI
KANAGAWA-KEN, JAPAN 243-0036
Correspondent:
HUSCH BLACKWELL LLP
120 S RIVERSIDE PLAZA
22ND FLOOR
CHICAGO, IL 60606

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