Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14593352
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Filing Dt:
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01/09/2015
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Publication #:
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Pub Dt:
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08/20/2015
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Inventor:
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Shih-Wen CHOU
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Title:
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MICRO ELECTRO MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D RD.1, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN R.O.C. |
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| KEITH TABOADA |
| 595 SHREWSBURY AVENUE |
| SUITE 100 |
| SHREWSBURY, NJ 07702 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D RD. 1, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| KEITH TABOADA |
| 595 SHREWSBURY AVENUE |
| SUITE 100 |
| SHREWSBURY, NJ 07702 |
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